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PROCESS CAPABILITY

NO. ITEM CAPACITY ADVANCED CAPACITY ILLUSTRATION
1 surface finish Immersion Ag、Immersion Tin、OSP、ENIG+OSP、Gold Plating+HASL ENIG+OSP、Gold Plating+HASL
2 tolerance of board thickness 0.4mm - 3.2mm 0.3mm - 6mm
3 layer 1-10 layer maximum can be 48 layers
4 Inner Layer Min.Clearance

0.16mm 4 layer board

0.18mm 6-8 layer board

0.25mm 10 layer board

0.15mm

0.15mm

0.20mm
5 Inner Layer Min.Trace Width/Spacing

1 oz: 0.1mm/0.1mm

2 oz: 0.15mm/0.15mm

3 oz: 0.20mm/0.25m

H oz: 0.1mm/0.075mm

1/3 oz: 0.075mm/0.075mm

4 oz: 0.25mm/0.30mm

5 oz: 0.35mm/0.38mm

6 oz: 0.40mm/0.45mm
6 Outer Layer Min.Trace Width/Spacing

1 oz: 0.12mm/0.15mm

1.5 oz: 0.15mm/0.18mm

2 oz: 0.22mm/0.22mm

3 oz: 0.25mm/0.35mm

4 oz: 0.30mm/0.40mm

5 oz: 0.40mm/0.50mm

6 oz: 0.50mm/0.60mm
7 Line spacing tolerance

Spacing≤80mm: ±0.10mm

Spacing≤120mm:±0.12mm

Spacing＞120mm: ±0.15mm

Spacing ≤80mm: ±0.075mm

Spacing ≤120mm: ±0.10mm

Spacing＞120mm: ±0.12mm
8 Impedance Control tolerance ±10% ±7%
9 Min Hole Diameter 0.2mm

0.15mm
10 Max Hole Diameter 6.0mm

＞6.0mm（To CNC)
11 NPTH tolerance ±0.05mm

＞±0.0254mm
12 PTH tolerance ±0.075mm

＞±0.05mm
13 PTH slot tolerance

drilled slot width tol: ±0.08mm

drilled slot length tol: ±0.08mm

drilled slot width tol: ±0.05mm

drilled slot length tol: ±0.05mm
14 NPTH slot tolerance

drilled slot width tol: ±0.025mm

drilled slot length tol: ±0.05mm

drilled slot width tol: ±0.025mm

drilled slot length tol: ±0.05mm
15 Hole Accuracy

min ±0.075mm

Min. ±0.05mm
16 Hole Accuracy

min 0.30mm

Anti-CAF: ≥0.45mm

min 0.25mm

Anti-CAF: ≥0.35mm
17 Hole Wall Spacing

10:1

12:1
18 s/m dam

Green/blue/red/yellow ink: min 0.07mm

black ink: 0.125mm white ink: 0.15mm

Green/blue/red/yellow ink: min 0.07mm

black ink: 0.10mm white ink: 0.125mm
19 Solder Mask Clearance min 0.05mm min 0.025mm
20 s/m covering line min 0.06mm min 0.05mm
21 s/m thickness about conductor

conductor corner ≥ 4μm

conductor print: 10-20μm second print:20-30μm

base board ≤co thickness + s/m conductor thickness

conductor corner ≥ 4μm

conductor print: 10-20μm second print:20-30μm

base board ≤co thickness + s/m thickness on copper
22 size of solder plug

0.2mm-0.5mm Aspect Ratio ≤ 8:1

0.15mm-0.55mm Aspect Ratio≤10:1
23 resin plug hole

0.2mm-0.6mm aspect ratio ≤ 15:1

blind hole 0.2mm-0.5mm aspect ratio ≤ 2:1

PTH 0.15mm-1.0mm aspect ratio ≤ 20:1

blind hole 0.2-0.5mm aspect ratio ≤ 2:1
24 min legend width 0.08mm

0.08mm
25 min legend height 0.71mm 0.71mm
26 min legend area size 0.15mm 0.12mm
27 min peelable mask thickness 0.30mm 0.30mm
28 max peelable mask thickness 0.60mm 0.60mm
29 First Carbon Ink Printing 10-20μm 10-20μm
30 Second Carbon Ink Printing 20-40μm 20-40μm
31 HASL-Tin Thickness 1μm-40μm 1.5μm-30μm
32 nickel thickness 3-8μm 3-8μm
33 ENIG thickness 0.025μm-0.075μm 0.025μm-0.1μm
34 OSP thickness 0.2μm-0.55μm 0.2μm-0.35μm
35 tin thickness 0.8μm-1.4μm 0.8μm-1.4μm
36 Ag thickness 0.15μm-0.40μm 0.15μm-0.40μm
37 gold plating thickness 0.10μm-2.5μm 0.10μm-2.5μm
38 Punching Tol & Min Space between conductor and edge ±0.10mm

board thickness＜1.0mm copper exposure area: 0.15mm copper exposure area：0.25mm

board thickness≥1.0mm copper exposure area: 0.15mm Unexposed copper area: 0.30mm

 ±0.05mm

board thickness＜1.0mm copper exposure area: 0.15mm copper exposure area: 0.25mm

board thickness≥1.0mm copper exposure area: 0.15mm Unexposed copper area: 0.30mm
39 V-cut line to V-cut lin Tol ±0.10mm ±0.075mm
40 V-cut Offset Tol ±0.1mm ±0.075mm
41 V-cut Angle 30°/45°/60° 30°/45°/60°
42 jump v-cut ≥15mm ≥15mm
43 bevelling depth tol ±0.1mm ±0.075mm
44 bevelling angle 20°/30°/45°/60° 15-45°(inside angle) 20°/30°/45°/60° 15-45°(inside angle)
45 Tol. ±0.13mm ±0.10mm