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Global market rebound in 2014 PCB industry recovery

DADE:2023-01-09 SOURCE:JINGTONG BROWSE:418
The 2014 Shenzhen International Circuit Board Purchasing Exhibition (CSSHOW) officially opened in Hall 6 of Shenzhen Convention and Exhibition Center on 26th. As the only industry event with PCB procurement as the theme in China, this year's CSSHOW is the first to integrate upstream and downstream enterprises, focus on displaying PCB manufacturing industry chain, and provide one-stop PCB/FPC procurement services for global electronics manufacturing enterprises. In the afternoon of the same day, "2014CSShow Shenzhen PCB Industry Development Forum" was jointly held by Shenzhen Circuit Board Industry Association (SPCA) and Taiwan Circuit Board Association (TPCA). The activity was coordinated with CSShow Shenzhen International Circuit Board Purchasing Exhibition and the exhibition of "NEPCONSouthChina". Therefore, the arrangement of this forum focuses on terminal topics: ZTE, NXP Semiconductor and Huaqiang Research Institute are arranged to give lectures on topics including communications, automotive issues, terminal brands, etc., to help the upstream and downstream circuit board enterprises to promote each other and better connect and develop. Mr. Liu Zhe, Chief engineer of ZTE, presented a discussion entitled "Development of communication electronics and its impact on electronic assembly Technology". Chief Engineer Liu has been engaged in communication equipment manufacturing engineering technology research for a long time, focusing on DFM/DFR, assembly process, assembly reliability, new technology/new process introduction, and has accumulated nearly 20 years of work experience. This time, he revealed the development trend of various components in the communication electronics assembly technology and pointed out the development trend of PCBA assembly technology in the communication industry from the aspects of communication evolution, such as multi-media demand, personalized demand and the development of the Internet. He said that with the development of high-density and refined assembly products and production aut